Melting and solidification behavior of PCM embedded in metal foam - Université Paris-Est-Créteil-Val-de-Marne Access content directly
Conference Papers Year : 2022
No file

Dates and versions

hal-04321923 , version 1 (04-12-2023)

Identifiers

  • HAL Id : hal-04321923 , version 1

Cite

Mohamed Moussa El Idi, Mustapha Karkri. Melting and solidification behavior of PCM embedded in metal foam. COMSOL CONFERENCE 2020 EUROPE, Oct 2022, Grenoble (Présentiel), France. ⟨hal-04321923⟩

Collections

UPEC CERTES
3 View
0 Download

Share

Gmail Facebook X LinkedIn More