Melting and solidification behavior of PCM embedded in metal foam - Université Paris-Est-Créteil-Val-de-Marne
Conference Papers Year : 2022
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hal-04321923 , version 1 (04-12-2023)

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  • HAL Id : hal-04321923 , version 1

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Mohamed Moussa El Idi, Mustapha Karkri. Melting and solidification behavior of PCM embedded in metal foam. COMSOL CONFERENCE 2020 EUROPE, Oct 2022, Grenoble (Présentiel), France. ⟨hal-04321923⟩

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